Ball Grid Array

TopLine Ball Grid Array
Dummy BGA Components. A cheap way to improve SMD assembly process. With Daisy Chain. Free catalog. Contact to order.
www.topline.tv

Land Grid Array
LGAs are used to enable high performance, separable electrical connections. They provide excellent signal integrity at high frequencies in fine pitch and low profile applications.
www.hcdcorp.com

Adapters-Plus - BGA Sockets
BGA (Ball Grid Array), QFP, PGA, Dip, SIP, Plcc, Soic, Tsop, Tssop, Ssop, sockets, socket receptacles, prototype and custom adapters products.
www.adapt-plus.com

Ball Grid Array Assembly Services
AxiomsMT.com provides highly advanced electronic circuit systems for engineering support and system integration. Specializing in BGA assembly and custom applications.
www.axiomsmt.com

Ball Grid Array
Search Thousands of Catalogs Today for ball grid array.
www.globalspec.com

BGA Repair & Fine Pitch
BGA Repair & Fine Pitch for OEMs. Expert resource for OEMs Repair for BGA & Fp Ic chips, get a BGA Repair Analysis.
panurgyoem.net

BGA Expertise
Maxtek, a Tektronix Company, providing the design, assembly and test of high-performance ball grid array packages.
www.maxtek.com

Equipment for Lead Free PCB Rework - BGA
Rework and repair equipment, including thru hole disordering stations and consumables. Vision placement convection hot air machines for eutectic and lead free solders.
www.ape.com

Bga
Find Shopping Deals at Yahoo! Low Prices On bga.
shopping.yahoo.com

Bga Soldering
Save huge on bga soldering. eBay! It's where you go to save.
www.eBay.com/deals

Warning: mkdir() [function.mkdir]: Permission denied in /home/webs/affiliatelib2/CacheManager.php on line 12

Warning: mkdir() [function.mkdir]: No such file or directory in /home/webs/affiliatelib2/CacheManager.php on line 12

Warning: fopen(/home/templatecore2cache//*cluesnet.com/ce/ce1aeb3428b830ad1ef98932d4ce45fcedac8284.tc2cache) [function.fopen]: failed to open stream: No such file or directory in /home/webs/affiliatelib2/CacheManager.php on line 130

Warning: fwrite(): supplied argument is not a valid stream resource in /home/webs/affiliatelib2/CacheManager.php on line 131

Warning: fclose(): supplied argument is not a valid stream resource in /home/webs/affiliatelib2/CacheManager.php on line 132

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits.

BGA assembled on a Printed circuit boardThe BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern. These pins are used to conduct electrical signals from the integrated circuit to the printed circuit board (PCB) it is placed on. In a BGA, the pins are replaced by balls of solder stuck to the bottom of the package. The SMT Placement Equipment on a PCB that carries copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a reflow oven or by an infrared heater, causing the solder balls to melt. Surface tension causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies.

Advantages High density The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins. Pin grid arrays and dual-in-line surface mount (SOIC) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process. As package pins got closer together, the danger of accidentally bridging adjacent pins with solder grew. BGAs do not have this problem, because the solder is sometimes factory-applied to the package in exactly the right amount.

Heat Conduction A further advantage of BGA packages over packages with discrete leads (i.e. packages with legs) is the lower thermal resistance between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.

Low Inductance leads The shorter an electrical conductor, the lower its inductance, a property which causes unwanted distortion of signals in high-speed electronic circuits. BGAs, with their very short distance between the package and the PCB, have low inductances and therefore have far superior electrical performance to leaded devices.

BGAs find some use in security-sensitive applications, especially where it is impossible to prevent physical access to the chip. For instance, a ROM chip with a BGA configuration is considerably more difficult to access than one in a Dual in-line package or Thin small-outline package layout. Tracing circuit paths to the BGA chip is limited by the contact points being obscured by the chip itself.

Disadvantages of BGA. Non compliant leads A disadvantage of BGAs, however, is that the solder balls cannot flex (non-compliant) in the way that longer leads can. Bending, due to a difference in Coefficient of thermal expansion between PCB substrate & BGA (thermal stress), or flexing & vibration (mechanical stress) can cause the solder joints to fracture. BGAs are therefore unpopular in certain fields, such as aerospace and military electronics. This problem can be overcome, at a cost, by matching the mechanical and thermal characteristics of the PCB to those of the BGA.

Another solution is to put a "compliant layer" in the package that allows the balls to physically move in relation to the package. This technique has become standard for packaging DRAMs in BGA packages.

Expensive inspection Another disadvantage of BGAs is that, once the package is soldered down, it is very difficult to look for soldering faults. X-ray machines and special microscopes have been developed to overcome this problem, but are expensive. If a BGA is found to be badly soldered, it can be removed in a rework station, which is a jig fitted with infrared lamp (or hot air), a thermocouple and a vacuum device for lifting the package. The BGA can be replaced with a new one, or can be refurbished or reballed. Packets of tiny ready-made solder balls are sold for this purpose.

BGA Variants

CBGA and PBGA denote the Ceramic or Plastic substrate material to which the array is attached.
FBGA or Fine Ball Grid Array based on ball grid array technology. It has thinner contacts and is mainly used in system-on-a-chip designs.

Known as FineLine BGA by Altera.